HEAT CONDUCTION MEMBER - NGK INSULATORS LTD

Title:

HEAT CONDUCTION MEMBER

Document Type and Number:

WIPO Patent Application WO/2012/067156

Kind Code:

A1

Abstract:

A heat conduction member is provided. When a cylindrical ceramic body is covered with a metal pipe, the heat conduction member can limit stress caused by thermal expansion difference while also maintaining a thermal coupling state. A heat conduction member (10) comprises: a cylindrical ceramic body (11); a metal pipe (12) around the cylindrical ceramic body (11); and an intermediate material (13) disposed between the cylindrical ceramic body (11) and the metal pipe (12). The cylindrical ceramic body (11) comprises a flow passage formed from one end to the other end thereof so that a first fluid functioning as a heating medium can flow therethrough. At least a portion of the intermediate material (13) has a Young's modulus of 1500 GPa or less. Therefore, heat can be exchanged between the first fluid and a second fluid due to the first fluid being caused to flow in the cylindrical ceramic body (11), and the second fluid, which has a temperature lower than that of the first fluid, being caused to flow to the outer circumferential surface (12h) side of the metal pipe (12).

Inventors:

YOSHIDA SHINYA (JP)
TAKAHASHI HIRONORI (JP)
KAWAGUCHI TATSUO (JP)

Application Number:

PCT/JP2011/076430

Publication Date:

May 24, 2012

Filing Date:

November 16, 2011

Export Citation:

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Assignee:

NGK INSULATORS LTD (JP)
YOSHIDA SHINYA (JP)
TAKAHASHI HIRONORI (JP)
KAWAGUCHI TATSUO (JP)

International Classes:

F28D1/04; B01J35/04; F16L9/14; F16L9/19; F28F1/00; F28F21/04

Domestic Patent References:

WO2008004492A1

2008-01-10

Foreign References:

JPH09327627A	1997-12-22
JPH07100390A	1995-04-18
JPH09164337A	1997-06-24
JPH08210128A	1996-08-20
JP2003513190A	2003-04-08
JP2005522625A	2005-07-28
JP2007117792A	2007-05-17

Other References: