Title:
HEAT CONDUCTION STRUCTURE AND PREPARATION METHOD THEREFOR, RADIATOR AND ELECTRONIC DEVICE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2023/103808
Kind Code:
A1
Abstract:
The present application relates to the technical field of heat dissipation, and in particular, to a heat conduction structure and a preparation method therefor, a radiator and an electronic device having same. The heat conduction structure comprises a heat conduction plate and a first capillary structure formed by an electrochemical deposition process. The first capillary structure is provided on the side of the heat conduction plate away from the heat source, wherein the first capillary structure is provided with a plurality of dielectric holes with different apertures, the plurality of dielectric holes extend in the thickness direction of the first capillary structure, and the plurality of dielectric holes penetrate through the first capillary structure. According to the heat conduction structure, the situation that the liquid return is not timely can be prevented, the problem of too high temperature difference under the high heating flux is solved, and the applicability and the heat dissipation effect of the heat conduction structure are improved.
Inventors:
YUAN WENWEN (CN)
SHI MINGBO (CN)
SHI MINGBO (CN)
Application Number:
PCT/CN2022/134229
Publication Date:
June 15, 2023
Filing Date:
November 25, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN107852811A | 2018-03-27 | |||
| CN101453859A | 2009-06-10 | |||
| CN101315912A | 2008-12-03 | |||
| CN107041102A | 2017-08-11 | |||
| US20140116669A1 | 2014-05-01 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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