Title:
HEAT-CONDUCTIVE ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2012/046710
Kind Code:
A1
Abstract:
Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surface thereof, an adhesive agent layer comprising the heat-conductive adhesive agent; and an lighting device comprising a substrate having a light-emitting element mounted thereon and a heat sink, wherein an adhesive agent layer comprising a heat-conductive adhesive agent is intercalated between the substrate and the heat sink. The heat-conductive adhesive agent can be used suitably, for example, for bonding a wiring substrate to a member for which heat-releasing properties are required, such as a heat sink and a housing.
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Inventors:
SAKAMOTO YOSHIMINE (JP)
Application Number:
PCT/JP2011/072826
Publication Date:
April 12, 2012
Filing Date:
October 04, 2011
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
SAKAMOTO YOSHIMINE (JP)
SAKAMOTO YOSHIMINE (JP)
International Classes:
C09J201/00; C09J7/10; C09J9/00; C09J11/04
Domestic Patent References:
| WO2011096287A1 | 2011-08-11 | |||
| WO2009025787A2 | 2009-02-26 |
Foreign References:
| JP2007158242A | 2007-06-21 | |||
| JP4086322B2 | 2008-05-14 |
Attorney, Agent or Firm:
AKAMATSU YOSHIHIRO (JP)
Yoshihiro Akamatsu (JP)
Yoshihiro Akamatsu (JP)
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Claims: