Title:
HEAT CONDUCTIVE ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/000285
Kind Code:
A1
Abstract:
A heat conductive adhesive film, comprising a composite adhesive layer. The composite adhesive layer comprises a mixture of a first component thermosetting adhesive and a second component pressure sensitive material adhesive; the weight percentage ratio of the first component thermosetting adhesive to the second component pressure sensitive material adhesive is 15%-95%:5%-85%. The heat conductive adhesive film combines the high adhesive strength of the second component pressure sensitive material adhesive and the thermosetting property of the first component thermosetting adhesive while bonding a heating element and a heat dissipating element; therefore, the heating element and the heat dissipating element are combined stably at room temperature, and the heat conductive adhesive film is prevented from peeling off from the heating element or the heat dissipating element at a high temperature; and thus the heat conductive adhesive film can be used for bonding the bonding interfaces between two materials having different temperatures. When the heat conductive film is bonded to the heating element or the heat dissipating element, air can be completely discharged, thus avoiding the existence of air bubbles and the formation of air gaps having high thermal resistance, and improving the heat dissipation effect and service life of the product.
Inventors:
CHEN HON-WEN (CN)
Application Number:
PCT/CN2017/090627
Publication Date:
January 03, 2019
Filing Date:
June 28, 2017
Export Citation:
Assignee:
CHEN HON WEN (CN)
International Classes:
C09J7/00; B32B15/08
Foreign References:
| CN104694032A | 2015-06-10 | |||
| CN202003978U | 2011-10-05 | |||
| CN102464954A | 2012-05-23 | |||
| CN102602076A | 2012-07-25 | |||
| CN103881597A | 2014-06-25 | |||
| US20050077618A1 | 2005-04-14 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT LAW FIRM (CN)
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