HEAT CONDUCTIVE COMPOSITION, HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE COMPOSITION MANUFACTURING METHOD, AND HEAT CONDUCTIVE SHEET MANUFACTURING METHOD

Title:

HEAT CONDUCTIVE COMPOSITION, HEAT CONDUCTIVE SHEET, HEAT CONDUCTIVE COMPOSITION MANUFACTURING METHOD, AND HEAT CONDUCTIVE SHEET MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2024/070250

Kind Code:

A1

Abstract:

A heat conductive composition according to the present invention contains a thermoplastic resin, a rosin-based resin, heat conductive particles, and low-melting-point metal particles, wherein the thermoplastic resin and the rosin-based resin include a volatile component, and the content ratio of the volatile component is 5.0 wt% or less.

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Inventors:

NAGASHIMA MINORU (JP)
NISHIO TAKESHI (JP)
SHIBUYA HIROKI (JP)
IWATA YUKI (JP)
KAWAKAMI RYOKO (JP)
ZHAO YIJING (JP)

Application Number:

PCT/JP2023/028858

Publication Date:

April 04, 2024

Filing Date:

August 08, 2023

Export Citation:

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Assignee:

DEXERIALS CORP (JP)

International Classes:

H01L23/36; C08J5/18; C08K3/08; C08L93/04; C08L101/00; H05K7/20

Attorney, Agent or Firm:

ITOH, Tadashige et al. (JP)

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