Title:
HEAT CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/108458
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a moisture-curable heat conductive composition which has excellent curability and does not have a specific outgas component adhere to a light emitting point of a laser diode.
The inventors have found that an aldehyde gas with 4-8 carbon atoms, said aldehyde gas being generated from a heat conductive composition that is heated to 60-90°C by light emission of a laser diode, adheres to a light emitting point of the laser diode and forms a foreign material.
The inventors have also found that in cases where the content of an organic metal catalyst having a hydrocarbon group with 4-8 carbon atoms is 0.02% by mass or less based on the total mass of the composition, a foreign material derived from an aldehyde gas with 4-8 carbon atoms is not formed on the light emitting point of the laser diode even if the heat conductive composition is heated to 60-90°C.
Inventors:
TOBITA YOSHIYUKI (JP)
Application Number:
PCT/JP2012/052846
Publication Date:
August 16, 2012
Filing Date:
February 08, 2012
Export Citation:
Assignee:
SUNSTAR ENGINEERING INC (JP)
TOBITA YOSHIYUKI (JP)
TOBITA YOSHIYUKI (JP)
International Classes:
C08L101/10; C08K3/00; C08K5/00; C08L71/02; C09J11/06; C09J171/02; C09J201/02; C09K5/08
Domestic Patent References:
| WO2010041708A1 | 2010-04-15 |
Foreign References:
| JP2002363429A | 2002-12-18 | |||
| JP2005325314A | 2005-11-24 | |||
| JP2006009037A | 2006-01-12 | |||
| JP2001302936A | 2001-10-31 | |||
| JP2002003732A | 2002-01-09 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
Download PDF:
Claims: