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Title:
HEAT-CONDUCTIVE FILLER, METHOD FOR PRODUCING SAID FILLER, RESIN COMPOSITION USING SAID FILLER, MOLDED ARTICLE PRODUCED FROM SAID RESIN COMPOSITION, AND HIGHLY HEAT-CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/119462
Kind Code:
A1
Abstract:
Provided are: a heat-conductive filler which is characterized by comprising particles which are produced by coating magnesium oxide with magnesium carbonate; a method for producing a heat-conductive filler, which is characterized by comprising the steps of injecting a carbon dioxide gas into a slurry that is prepared by dispersing magnesium oxide particles in water and then performing a hydrothermal treatment while dissolving carbon dioxide in water; a resin composition prepared using the heat-conducive filler; and a molded product of the resin composition. The heat-conductive filler, the resin composition, the molded product of the resin composition, and a highly heat-conductive material produced using the molded article have excellent heat conductivity and wet heat resistance.

Inventors:
TAKADA SHINGO (JP)
KUROKI KATSUHITO (JP)
YAMAUCHI NOBUHIKO (JP)
TAKAHASHI SHINICHI (JP)
Application Number:
PCT/JP2014/051366
Publication Date:
August 07, 2014
Filing Date:
January 23, 2014
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09C3/06; C08K3/26; C08K9/02; C08L101/00; C09C1/02
Foreign References:
JP2011068757A2011-04-07
JP2004027177A2004-01-29
JP2006282783A2006-10-19
JP2011046760A2011-03-10
JP2012119180A2012-06-21
JP2006291078A2006-10-26
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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