Title:
HEAT CONDUCTIVE LAMP HOUSING AND MANUFACTURING METHOD THEREOF AND LAMP
Document Type and Number:
WIPO Patent Application WO/2015/066855
Kind Code:
A1
Abstract:
A heat conductive lamp housing (1, 2) and manufacturing method thereof and lamp; the heat conductive lamp housing (1, 2) comprises a ceramic casing (11, 21) for installing an LED light source assembly, and a heat conductive layer (12, 22) contacting the LED light source assembly (3) and conducting the heat of the LED light source assembly (3); the heat conductive layer (12, 22) is embedded and closely fits into the ceramic casing (11, 21) in the length direction of the ceramic casing (11, 21); and the heat conductive layer (12, 22) conducts the heat of the LED light source assembly (3), having good heat conduction effect, ensuring normal operation of the LED light source assembly (3), and being safe to use.
Inventors:
LU TINGSUNG (CN)
Application Number:
PCT/CN2013/086607
Publication Date:
May 14, 2015
Filing Date:
November 06, 2013
Export Citation:
Assignee:
RISHANG OPTOELECTRONICS CO LTD (CN)
International Classes:
F21V29/00; F21V15/02; F21V29/83; F21Y101/02
Foreign References:
| CN201875469U | 2011-06-22 | |||
| CN201696946U | 2011-01-05 | |||
| ES1075222U | 2011-08-19 | |||
| CN202561690U | 2012-11-28 |
Attorney, Agent or Firm:
SHENZHEN REFINED INTELLECTUAL PROPERTY OFFICE (GENERAL PARTNERSHIP) (CN)
深圳市瑞方达知识产权事务所（普通合伙） (CN)
深圳市瑞方达知识产权事务所（普通合伙） (CN)
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