Title:
HEAT-CONDUCTIVE MASSIVE ADHESIVE AGENT, HEAT-CONDUCTIVE ADHESIVE SHEET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/116891
Kind Code:
A1
Abstract:
Provided is a technique whereby, after forming a massive solid adhesive agent, a heat-conductive sheet having a thickness suitable for use can be prepared. By forming a heat-conductive solid adhesive agent (11) which is in the form of a single "block", a heat-conductive adhesive sheet (12), which is in the form of a "sheet" having a thickness suitable for each use, can be easily obtained by cutting or the like. When the heat-conductive adhesive sheet (12) is positioned between adherends and then a reaction with a latent curing agent is carried out, the latent curing agent reacts with a polymer base material (13) and thus the adherends can be adhered together.
Inventors:
KUDOH HIROKI (JP)
NUNOKAWA TAKEHIKO (JP)
NUNOKAWA TAKEHIKO (JP)
Application Number:
PCT/JP2010/055215
Publication Date:
October 14, 2010
Filing Date:
March 25, 2010
Export Citation:
Assignee:
POLYMATECH CO LTD (JP)
KUDOH HIROKI (JP)
NUNOKAWA TAKEHIKO (JP)
KUDOH HIROKI (JP)
NUNOKAWA TAKEHIKO (JP)
International Classes:
C09J201/00; C09J7/00; C09J11/00; C09J11/04; C09J11/06; C09J163/00; H01L23/36; H01L23/373
Foreign References:
| JPS61179284A | 1986-08-11 | |||
| JP2007277384A | 2007-10-25 | |||
| JP2008095071A | 2008-04-24 | |||
| JP2001081435A | 2001-03-27 | |||
| JP2002088171A | 2002-03-27 | |||
| JP2003301048A | 2003-10-21 |
Attorney, Agent or Firm:
OHTAKE Seigo et al. (JP)
Shogo Otake (JP)
Shogo Otake (JP)
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