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Title:
HEAT CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/097404
Kind Code:
A1
Abstract:
The present invention provides a heat conductive member which has both high heat conductivity and low hardness.　This heat conductive member is a multilayer body that is provided with a plurality of layers that include a first layer and a second layer, which are stacked at positions where the first layer and the second layer are in contact with each other. The first layer is configured from a first heat conductive composition that contains at least a first acrylic binder, a first heat conductive filler and a dispersant. The dispersant contains at least one of a linear polyester that has a weight average molecular weight of from 1,000 to 2,500, while having phosphoric acid at an end, and a polyester-polyether copolymer that has a weight average molecular weight of from 1,000 to 2,500, while having phosphoric acid at an end.

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Inventors:
TACHI NAOHIRO (JP)
Application Number:
PCT/JP2021/036675
Publication Date:
May 12, 2022
Filing Date:
October 04, 2021
Export Citation:
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Assignee:
KITAGAWA IND CO LTD (JP)
International Classes:
B32B27/18; B32B7/027; B32B27/30; H01L23/36; H01L23/373; H05K7/20
Foreign References:
US20190217582A12019-07-18
JP2008111053A2008-05-15
JP2011054609A2011-03-17
JP6710828B22020-06-17
JP2019015885A2019-01-31
JPH0410828B21992-02-26
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
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