Title:
HEAT-CONDUCTIVE POLYORGANOSILOXANE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/221662
Kind Code:
A1
Abstract:
This heat-conductive polysiloxane composition contains (A) a heat-conductive filler; (B) a polyorganosiloxane resin having curable functional groups in polysiloxane molecules, the polyorganosiloxane resin including at least one type of polysiloxane (b1) having one curable functional group in a molecule; (C) a siloxane compound having alkoxysilyl groups and a linear siloxane structure; (D) a hydrodiene polyorganosiloxane; and (E) a platinum catalyst. The content of the polysiloxane (b1) having one curable functional group in a molecule is more than 80 mass% in terms of the total polyorganosiloxane resin (B).
Inventors:
SAKAMOTO ATSUSHI (JP)
IIDA ISAO (JP)
IIDA ISAO (JP)
Application Number:
PCT/JP2018/020986
Publication Date:
December 06, 2018
Filing Date:
May 31, 2018
Export Citation:
Assignee:
MOMENTIVE PERFORMANCE MAT JP (JP)
International Classes:
C08L83/07; C08K3/00; C08L83/05; C08L83/06
Foreign References:
| JP2009203373A | 2009-09-10 | |||
| JPH11222555A | 1999-08-17 | |||
| JP2003213133A | 2003-07-30 | |||
| JPS63256773A | 1988-10-24 | |||
| JP2002003831A | 2002-01-09 | |||
| JP2005030874A | 2005-02-07 |
Other References:
See also references of EP 3636715A4
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF: