HEAT-CONDUCTIVE, PRESSURE-SENSITIVE ADHESIVE COMPOSITION, HEAT-CONDUCTIVE, PRESSURE-SENSITIVE ADHESIVE SHEET FORMED BODY, METHOD FOR PRODUCING EACH, AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2012/132657

A1

Provided are: a heat-conductive, pressure-sensitive adhesive composition provided in a balanced fashion with heat conductivity and insulating properties and characterized by, in a mixed composition containing a predetermined quantity of each of a (meth)acrylic resin composition containing a (meth)acrylic ester polymer (A1) and a (meth)acrylic ester monomer (α1), a heat-conductive filler (B) having an average particle size of no greater than 50 μm, and zinc oxide (C) having an acicular section, the length of the acicular section being 2-50 μm inclusive, the adhesive composition resulting from performing a polymerization reaction of the (meth)acrylic ester monomer mixture, and a cross-linking reaction of a polymer containing a structural unit derived from the (meth)acrylic ester monomer (α1) and/or the (meth)acrylic ester polymer (A1); a heat-conductive, pressure-sensitive adhesive sheet formed body; a method for producing the composition and the body; and an electronic component provided with the heat-conductive, pressure-sensitive adhesive composition and the heat-conductive, pressure-sensitive adhesive sheet formed body.

KUMAMOTO TAKUROU (JP)
KAWAMURA HIROMI (JP)

PCT/JP2012/054290

October 04, 2012

February 22, 2012

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ZEON CORP (JP)
KUMAMOTO TAKUROU (JP)
KAWAMURA HIROMI (JP)

C09J133/06; C09J4/02; C09J7/10; C09J11/04; H01L23/373

WO2009157315A1

2009-12-30

JP2002285121A	2002-10-03
JP2010047725A	2010-03-04
JP2008127481A	2008-06-05
JPH02263882A	1990-10-26
JPH01225663A	1989-09-08

YAMAMOTO, Noriaki et al. (JP)
Yamamoto 典輝 (JP)

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