Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT CONDUCTIVE RESIN COMPOSITION, HEAT CONDUCTIVE SHEET, AND HEAT CONDUCTIVE SHEET PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/008567
Kind Code:
A1
Abstract:
The present invention relates to a heat conductive resin composition. This heat conductive resin composition comprises a resin component (A), a heat conductive filler (B), and a plasticizer (C) wherein: the resin component (A) contains a (meth)acrylic polymer (a1) having a (meth)acrylic structure represented by formula [1] and having two or more reactive functional groups; and the plasticizer (C) contains an aromatic carboxylate ester.

Inventors:
NAKATANI, Koji (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2018/025373
Publication Date:
January 09, 2020
Filing Date:
July 04, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
C08F299/00
Foreign References:
JP2011184557A2011-09-22
JPH10316953A1998-12-02
JP2012233099A2012-11-29
JP2011187899A2011-09-22
JP2009179743A2009-08-13
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Festival Tower West, 2-4 Nakanoshima 3-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
Download PDF: