Title:
HEAT CONDUCTIVE RESIN COMPOSITION, HEAT CONDUCTIVE SHEET, AND HEAT CONDUCTIVE SHEET PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/008567
Kind Code:
A1
Abstract:
The present invention relates to a heat conductive resin composition. This heat conductive resin composition comprises a resin component (A), a heat conductive filler (B), and a plasticizer (C) wherein: the resin component (A) contains a (meth)acrylic polymer (a1) having a (meth)acrylic structure represented by formula [1] and having two or more reactive functional groups; and the plasticizer (C) contains an aromatic carboxylate ester.
Inventors:
NAKATANI KOJI (JP)
Application Number:
PCT/JP2018/025373
Publication Date:
January 09, 2020
Filing Date:
July 04, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08F299/00
Foreign References:
| JP2011184557A | 2011-09-22 | |||
| JPH10316953A | 1998-12-02 | |||
| JP2012233099A | 2012-11-29 | |||
| JP2011187899A | 2011-09-22 | |||
| JP2009179743A | 2009-08-13 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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