Title:
HEAT-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/115649
Kind Code:
A1
Abstract:
The present invention is capable of providing a heat-conductive resin composition containing 70 to 20 parts by volume of (A) a polyester resin having a melt viscosity at 200°C and 10 kgf loading of 5 to 10,000 dPa·s, and 30 to 80 parts by volume of (B) a heat-conductive filler, wherein the heat-conductive resin is characterized in that the heat-conductive filler (B) contains zinc oxide and magnesium oxide and is a mixture of two or more types having different average particle sizes, the zinc oxide having a smaller average particle size than that of the magnesium oxide. The highly heat-conductive resin composition exhibits excellent performance as a filler and excellent heat and humidity resistance.
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Inventors:
SHIMOHARAI TAKUYA (JP)
MITSUNAGA HIROYUKI (JP)
KOBAYASHI KOJI (JP)
MITSUNAGA HIROYUKI (JP)
KOBAYASHI KOJI (JP)
Application Number:
PCT/JP2014/050776
Publication Date:
July 31, 2014
Filing Date:
January 17, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08L67/00; C08K3/22
Domestic Patent References:
| WO2012086673A1 | 2012-06-28 |
Foreign References:
| JP2007099820A | 2007-04-19 | |||
| JP2008270709A | 2008-11-06 | |||
| JP2013014758A | 2013-01-24 | |||
| JP2013014757A | 2013-01-24 |
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