Title:
HEAT-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/043070
Kind Code:
A1
Abstract:
Provided is a heat-conductive resin composition having a specific gravity of 1.4-2.0 and surface heat conductivity of 1 W/(m⋅K) or higher, the resin composition containing at least (A) 30-90% by mass of a thermoplastic resin, (B) 9-69% by mass of an inorganic filler having heat conductivity of 1 W/(m⋅K) or higher, and (C) 0.05-10% by mass of a crystallization accelerator.
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Inventors:
EZAKI TOSHIAKI
SAEGUSA KAZUNORI
SAEGUSA KAZUNORI
Application Number:
PCT/JP2016/004061
Publication Date:
March 16, 2017
Filing Date:
September 06, 2016
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/00; C08K3/00; C08K5/00; C08L67/00; F21V29/503; F21V29/76; F21V29/87; F21W101/10; F21W101/14
Domestic Patent References:
| WO2014024743A1 | 2014-02-13 | |||
| WO2013133181A1 | 2013-09-12 |
Foreign References:
| JP2011231159A | 2011-11-17 | |||
| US20140043754A1 | 2014-02-13 | |||
| JP2012072351A | 2012-04-12 | |||
| JPH1060287A | 1998-03-03 | |||
| JPS5761045A | 1982-04-13 | |||
| JP2014074083A | 2014-04-24 | |||
| JP2014078335A | 2014-05-01 |
Other References:
See also references of EP 3348618A4
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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