Title:
HEAT-CONDUCTIVE SHEET, METHOD FOR ATTACHING SAME AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/070568
Kind Code:
A1
Abstract:
This heat-conductive sheet comprises: a binder component that is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) dispersed in the binder component. The heat-conductive sheet exhibits a compression rate of 15% or more at 80°C and 0.276 MPa, and has a shape retaining property.
Inventors:
NAMIKI KAZUHIRO (JP)
IWAZAKI HIROMICHI (JP)
KUROO KENTA (JP)
KUDOH HIROKI (JP)
IWAZAKI HIROMICHI (JP)
KUROO KENTA (JP)
KUDOH HIROKI (JP)
Application Number:
PCT/JP2021/027302
Publication Date:
April 07, 2022
Filing Date:
July 21, 2021
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H05K7/20; C08K3/01; C08L23/00; C08L83/04; H01L23/36
Domestic Patent References:
| WO2020039560A1 | 2020-02-27 |
Foreign References:
| JP2010185052A | 2010-08-26 | |||
| JP2013127035A | 2013-06-27 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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