Title:
HEAT CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/176748
Kind Code:
A1
Abstract:
A heat conductive sheet of an embodiment comprises a heat conductive filler including carbon fibers and at least one of aluminum nitride, aluminum oxide and aluminum hydroxide as an inorganic filler, and a two-component addition reaction silicone having a volume ratio of 30-45%, so that a heat conductive sheet having a small amount of creep, while having a low residual stress, a low thermal resistance value and good tackiness can be obtained by a simple process.
Inventors:
MUKASA KEISUKE (JP)
KUBO YUSUKE (JP)
ARAMAKI KEISUKE (JP)
KUBO YUSUKE (JP)
ARAMAKI KEISUKE (JP)
Application Number:
PCT/JP2022/005216
Publication Date:
August 25, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; C08K3/22; C08K7/06; C08L83/04; H01L23/373; H05K7/20
Foreign References:
JP2017135371A | 2017-08-03 | |||
JP2015029071A | 2015-02-12 | |||
JP2015092534A | 2015-05-14 | |||
JPH1121388A | 1999-01-26 | |||
JP2020013872A | 2020-01-23 | |||
JP2015035580A | 2015-02-19 | |||
JP2021190698A | 2021-12-13 |
Attorney, Agent or Firm:
TORANOMON INTELLECTUAL PROPERTY FIRM (JP)
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