Title:
HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/020862
Kind Code:
A1
Abstract:
A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.
Inventors:
ENDO AKIHIRO (JP)
ISHIHARA YASUHISA (JP)
TSUCHIYA TORU (JP)
YAMAGUCHI HISAHARU (JP)
MOTEKI MASAHIRO (JP)
MARUYAMA TAKAHIRO (JP)
ISHIHARA YASUHISA (JP)
TSUCHIYA TORU (JP)
YAMAGUCHI HISAHARU (JP)
MOTEKI MASAHIRO (JP)
MARUYAMA TAKAHIRO (JP)
Application Number:
PCT/JP2017/021498
Publication Date:
February 01, 2018
Filing Date:
June 09, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L23/36; B32B5/28; B32B27/00; C08K3/22; C08L83/06; C08L83/07; H05K7/20
Foreign References:
| JPH06155517A | 1994-06-03 | |||
| JPH01173514A | 1989-07-10 | |||
| JP2015233104A | 2015-12-24 | |||
| JP2012131682A | 2012-07-12 | |||
| JP2007059877A | 2007-03-08 | |||
| JPH02199020A | 1990-08-07 |
Other References:
See also references of EP 3493254A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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