Title:
HEAT CONDUCTIVE SILICONE COMPOSITION, HEAT CONDUCTIVE LAYER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/115456
Kind Code:
A1
Abstract:
Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25°C of 10 to 100,000 mm2/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m°C or higher, (D) an organohydrogen polysiloxane expressed by formula (2), (E) an organohydrogen polysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed.
Inventors:
TSUJI KENICHI (JP)
YAMADA KUNIHIRO (JP)
KIZAKI HIROAKI (JP)
MATSUMOTO NOBUAKI (JP)
YAMADA KUNIHIRO (JP)
KIZAKI HIROAKI (JP)
MATSUMOTO NOBUAKI (JP)
Application Number:
PCT/JP2013/084211
Publication Date:
July 31, 2014
Filing Date:
December 20, 2013
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08K3/00; C08L83/05; C08L83/06; C08L83/07; H01L23/373
Foreign References:
JP2008038137A | 2008-02-21 | |||
JP2002327116A | 2002-11-15 | |||
JP2007214224A | 2007-08-23 | |||
JP2010013521A | 2010-01-21 | |||
JP2013010862A | 2013-01-17 | |||
JP2012102283A | 2012-05-31 |
Attorney, Agent or Firm:
KOJIMA Takashi et al. (JP)
Takashi Kojima (JP)
Takashi Kojima (JP)
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