Title:
HEAT-CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/021956
Kind Code:
A1
Abstract:
A heat-conductive silicone composition according to the present invention contains: (A) an addition reaction product between (a) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon group per molecule and having a kinematic viscosity of 60 mm2/s or more at 25°C, and (b) an organohydrogen polysiloxane having two or more hydrogen atoms each bound to a silicon atom per molecule; (B) a heat-conductive filler in an amount of 10-96 mass% with respect to the whole of the composition; and (C) a cyclic organopolysiloxane having an oxirane ring represented by general formula (1) in an amont of 1-20 parts by mass with respect to 100 parts by mass of component (A). Accordingly, provided is a heat-conductive silicone composition that has good pumping-out resistance and excellent application workability by maintaining appropriate viscosity while being a non-cured type composition containing a large amount of a heat-conductive filler, and that can achieve low heat resistance by being thinly compressed.
Inventors:
KITAZAWA KEITA (JP)
Application Number:
PCT/JP2022/029157
Publication Date:
February 23, 2023
Filing Date:
July 28, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/10; C08K3/013; C08L63/00; C08L83/06; C09K5/14
Domestic Patent References:
| WO2016052521A2 | 2016-04-07 |
Foreign References:
| JP2020169254A | 2020-10-15 | |||
| CN103923464A | 2014-07-16 | |||
| JP2021098804A | 2021-07-01 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: