Title:
HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/175001
Kind Code:
A1
Abstract:
A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 μm in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B) > (A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000Pa·s at 25ºC.
Inventors:
ICHIROKU NOBUHIRO (JP)
Application Number:
PCT/JP2016/061248
Publication Date:
November 03, 2016
Filing Date:
April 06, 2016
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/08; C08K3/22; C08K3/28; C08L63/00; C09K5/14; C10M107/24; C10M107/50; C10M125/04; C10M125/10; C10M125/20; C10M125/26; C10N10/02; C10N10/04; C10N10/06; C10N10/08; C10N10/16; C10N20/00; C10N20/02; C10N20/06; C10N30/00; C10N30/02; C10N40/00; C10N50/10
Domestic Patent References:
| WO2014136773A1 | 2014-09-12 | |||
| WO2013077351A1 | 2013-05-30 |
Foreign References:
| JP2009096961A | 2009-05-07 | |||
| JP2010059237A | 2010-03-18 | |||
| JP2011140566A | 2011-07-21 | |||
| JP2010100665A | 2010-05-06 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Patent business corporation Hideaki international patent firm (JP)
Patent business corporation Hideaki international patent firm (JP)
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