HEAT-CURABLE ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2017/104670

A1

Provided are: a heat-curable adhesive sheet that reduces warping of a semiconductor wafer and reduces the occurrence of chipping; and a production method for a semiconductor device. The heat-curable adhesive sheet has a heat-curable adhesive layer comprising a resin composition containing a filler and a resin component including an epoxy compound and a curing agent. A value for the total obtained when the reciprocal of the epoxy equivalent for the epoxy compound is multiplied by the epoxy compound content ratio in the resin component is at least 1.15E-04. The filler blending amount is at least 50 parts by mass relative to 100 parts by mass resin component. The heat-curable adhesive sheet is pasted to a polished surface of a semiconductor wafer and cured, prior to dicing.

JP7334604	Adhesive composition for polarizing plate, polarizing plate with adhesive layer, and in-vehicle display device
WO/2019/189618	ELECTRONIC DEVICE-SEALED BODY, SHEET-SHAPED ADHESIVE, ADHESIVE FILM FOR SEALING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE-SEALED BODY
WO/2015/115781	CONDUCTIVE ADHESIVE COMPRISING CONDUCTIVE POLYMER AND ADHESIVE FILM

MORI DAICHI (JP)
ISHIMATSU TOMOYUKI (JP)

PCT/JP2016/087090

June 22, 2017

December 13, 2016

Click for automatic bibliography generation  

DEXERIALS CORP (JP)

C09J7/10; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L21/301; H01L21/304

WO2013161864A1	2013-10-31
WO2015046529A1	2015-04-02

JP2015032644A	2015-02-16
JP2014197675A	2014-10-16
JP2013181049A	2013-09-12

NOGUCHI, Nobuhiro (JP)

View/Download PDF      PDF Help

Previous Patent: HEAT-CURABLE ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Next Patent: METHOD FOR PRODUCING AQUEOUS SYNTHETIC RESIN EMULSION, METHOD FOR PRODUCING REEMULSIFIABLE SYNTHETIC...