Title:
HEAT-CURABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/281906
Kind Code:
A1
Abstract:
Provided is a heat-curable adhesive sheet which includes a release liner that is adherent to the adhesive surface and that, when peeled from the adhesive surface, is easy to peel off and which has excellent handleability and is less apt to suffer protrusion of the adhesive. The heat-curable adhesive sheet 1 has a 20°C modulus G' of 150-3,000 kPa and an 80°C modulus G' of 1 kPa or greater. The heat-curable adhesive sheet 1 preferably includes an epoxy resin (a) having an epoxy equivalent of 200-800 g/eq and a rubber-modified epoxy resin (b).
Inventors:
TACHIKAWA YU (JP)
KIUCHI KAZUYUKI (JP)
KUMADA TATSUYA (JP)
HARA YUSUKE (JP)
KIUCHI KAZUYUKI (JP)
KUMADA TATSUYA (JP)
HARA YUSUKE (JP)
Application Number:
PCT/JP2022/019362
Publication Date:
January 12, 2023
Filing Date:
April 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/35; C09J11/04; C09J11/06; C09J163/00
Domestic Patent References:
| WO2018047919A1 | 2018-03-15 | |||
| WO2014017537A1 | 2014-01-30 |
Foreign References:
| JP2006049482A | 2006-02-16 | |||
| US20090136748A1 | 2009-05-28 | |||
| JP2016050224A | 2016-04-11 | |||
| JP2002265888A | 2002-09-18 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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