Title:
HEAT CURABLE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2007/088666
Kind Code:
A1
Abstract:
This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The heat curable adhesive comprises a photoradical generating agent, which generates radicals upon exposure to an actinic radiation, contained in a heat curable insulating adhesive component. A repair method using this heat curable adhesive comprises, before separating the electronic component from the substrate, applying an actinic radiation to a cured product of the heat curable adhesive from the substrate side or the electronic component side to render the cured product soluble in or swellable with a predetermined solvent, and removing the cured product with the solvent. Alternatively, the repair method may comprise, after separating the electronic component from the substrate, applying an actinic radiation to a cured product of the heat curable adhesive to render the cured product soluble in or swellable with a predetermined solvent, and removing the cured product with the solvent.
Inventors:
FUJITA YASUHIRO (JP)
Application Number:
PCT/JP2006/323567
Publication Date:
August 09, 2007
Filing Date:
November 27, 2006
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
FUJITA YASUHIRO (JP)
FUJITA YASUHIRO (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/06; H01B1/22; H01B5/16; H01R11/01
Foreign References:
| JPH11191320A | 1999-07-13 |
Attorney, Agent or Firm:
TAJIME & TAJIME (New-Well-Ikuta Bldg. 26-28, Mita 1-chome, Tama-k, Kawasaki-shi Kanagawa 34, JP)
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