Title:
HEAT-CURABLE COMPOSITION AND LAMINATED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/112165
Kind Code:
A1
Abstract:
Provided are: a heat-curable composition having an excellent adhesion property and excellent storage stability; and a laminated structure produced using the composition. A heat-curable composition characterized by comprising (A) a blocked isocyanate which has been blocked with at least two types of block agents, (B) a curing catalyst and (C) a hydroxy-group-containing resin having a glass transition temperature (Tg) of 25˚C or lower; and a laminated structure produced using the composition.
Inventors:
FUNAKOSHI CHIHIRO (JP)
Application Number:
PCT/JP2013/078032
Publication Date:
July 24, 2014
Filing Date:
October 16, 2013
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G18/80; B32B27/40; C08G18/16; C08G18/42; C09J167/00; C09J175/04; C09J175/06; C09J201/06
Foreign References:
| JP2012012567A | 2012-01-19 | |||
| JP2011231306A | 2011-11-17 | |||
| JPH10251373A | 1998-09-22 | |||
| JP2002119911A | 2002-04-23 | |||
| JP2001072738A | 2001-03-21 | |||
| JP2008266579A | 2008-11-06 | |||
| JP2002279380A | 2002-09-27 | |||
| JP2010248345A | 2010-11-04 |
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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