Title:
HEAT-CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/032943
Kind Code:
A1
Abstract:
A heat-curable composition including a main agent with a glycidyl ether group, and a solid latent curing agent, wherein the particle size prior to heat curing is 40 μm or less.
Inventors:
YAGI KENICHI (JP)
NAKAI KYOKO (JP)
KATO YUICHI (JP)
SUDOU EIICHI (JP)
SAKAI KIYOFUMI (JP)
MABUCHI OSAMU (JP)
NAKAI KYOKO (JP)
KATO YUICHI (JP)
SUDOU EIICHI (JP)
SAKAI KIYOFUMI (JP)
MABUCHI OSAMU (JP)
Application Number:
PCT/JP2022/032494
Publication Date:
March 09, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
TOYODA GOSEI KK (JP)
International Classes:
C08G59/40; C08G59/24; C08G59/50; C08G59/56; C08L51/04; C08L63/00
Domestic Patent References:
| WO2017099060A1 | 2017-06-15 | |||
| WO2019065663A1 | 2019-04-04 |
Foreign References:
| JP2011157491A | 2011-08-18 | |||
| JPH0616788A | 1994-01-25 | |||
| JPH11209580A | 1999-08-03 | |||
| JP2018532014A | 2018-11-01 | |||
| JPS60124618A | 1985-07-03 | |||
| JPS6096617A | 1985-05-30 | |||
| JPS6134019A | 1986-02-18 | |||
| JP2005239922A | 2005-09-08 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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