Title:
HEAT-CURABLE RESIN COMPOSITION, CURED OBJECT, MOLDING MATERIAL, AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2017/187783
Kind Code:
A1
Abstract:
The present invention provides a heat-curable resin composition which is capable of giving cured objects excellent in terms of toughness and adhesiveness, without considerably lowering the mechanical strength or heat resistance. The present invention further provides a cured object, a molding material, and a molded object which are obtained from or including the heat-curable resin composition.
The heat-curable resin composition of the present invention comprises a compound having a maleimide group and a polyrotaxane that comprises cyclic molecules, a linear molecule piercing through the cavities of the cyclic molecules in a skewered state, and blocking groups with which both ends of the linear molecule have been blocked.
Inventors:
NISHIOKA KIYOSHI (JP)
MASUHARA YUSAKU (JP)
ZHAO CHANGMING (JP)
OHTSUKA KEIKO (JP)
KIMURA HAJIME (JP)
MATSUMOTO AKIHIRO (JP)
MASUHARA YUSAKU (JP)
ZHAO CHANGMING (JP)
OHTSUKA KEIKO (JP)
KIMURA HAJIME (JP)
MATSUMOTO AKIHIRO (JP)
Application Number:
PCT/JP2017/008472
Publication Date:
November 02, 2017
Filing Date:
March 03, 2017
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
ADVANCED SOFTMATERIALS INC (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
ADVANCED SOFTMATERIALS INC (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
International Classes:
C08L79/00; C08F2/44; C08F283/06; C08F290/10; C08F290/14; C08G73/02; C08L35/00; C08L71/00
Domestic Patent References:
| WO2007083522A1 | 2007-07-26 | |||
| WO2010026957A1 | 2010-03-11 |
Foreign References:
| JPH05295111A | 1993-11-09 | |||
| JPH07149952A | 1995-06-13 | |||
| JPH0641332A | 1994-02-15 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: