Title:
HEAT CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, PROCESS FOR PRODUCING THE RESIN COMPOSITION, AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/059856
Kind Code:
A1
Abstract:
This invention provides a heat curable resin composition for light reflection,
which, after curing, can realize high reflectance in a range of visible light
to near ultraviolet light, has excellent heat deterioration resistance and
tablet moldability, and is less likely to cause burrs during transfer molding,
and a process for producing the resin composition, and an optical semiconductor
element mounting substrate and an optical semiconductor device using the resin
composition. The heat curable resin composition for light reflection comprises
a heat curable component and a white pigment and is characterized in that the length
of burrs caused upon transfer molding under conditions of molding temperature
100ºC to 200ºC, molding pressure not more than 20 MPa, and moldingtime
60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at
a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can
be used for constructing the optical semiconductor element mounting substrate
and the optical semiconductor device.
Inventors:
KOTANI HAYATO
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI
Application Number:
PCT/JP2007/072069
Publication Date:
May 22, 2008
Filing Date:
November 14, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
KOTANI HAYATO
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI
KOTANI HAYATO
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI
International Classes:
C08G59/32; B29B7/80; B29C45/02; B29C45/14; H01L23/29; H01L23/31; H01L33/48
Domestic Patent References:
| WO2007015426A1 | 2007-02-08 | |||
| WO2007015427A1 | 2007-02-08 | |||
| WO2005042630A2 | 2005-05-12 |
Foreign References:
| JP2007297601A | 2007-11-15 | |||
| JP2007129173A | 2007-05-24 | |||
| JP2007235085A | 2007-09-13 | |||
| JP2006140207A | 2006-06-01 | |||
| JP2006156704A | 2006-06-15 | |||
| JP2003224305A | 2003-08-08 | |||
| JP2005171119A | 2005-06-30 | |||
| JP2005036218A | 2005-02-10 | |||
| JP2005089710A | 2005-04-07 | |||
| JP2005053978A | 2005-03-03 | |||
| JP2001118969A | 2001-04-27 | |||
| JP2006140207A | 2006-06-01 |
Other References:
See also references of EP 2100908A4
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (2-8 Toranomon 1-chome,Minato-k, Tokyo 01, JP)
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