Title:
HEAT-CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/281922
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a heat-curable resin composition for light reflection which comprises an epoxy resin, a hardener, a benzoxazole compound having fluorescent intensity at 410-500 nm, inorganic hollow particles, and a white pigment.
Inventors:
YAMAMOTO TAKASHI (JP)
SUTO HIKARU (JP)
NAKAMURA RYUTA (JP)
OKADA JUNKO (JP)
ENDO YOSHINORI (JP)
SUTO HIKARU (JP)
NAKAMURA RYUTA (JP)
OKADA JUNKO (JP)
ENDO YOSHINORI (JP)
Application Number:
PCT/JP2022/020531
Publication Date:
January 12, 2023
Filing Date:
May 17, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08K5/353; C08K3/013; C08K7/24; C08L63/00; H01L33/60
Foreign References:
| JP2019108457A | 2019-07-04 | |||
| JP2015152643A | 2015-08-24 | |||
| JP2014221856A | 2014-11-27 | |||
| JP2017020026A | 2017-01-26 | |||
| JP6417320B2 | 2018-11-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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