Title:
HEAT-CURABLE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE AND OBTAINED USING SAME, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/083576
Kind Code:
A1
Abstract:
In the present invention, in an optical semiconductor device provided with a metal lead frame and a reflector formed in a manner so as to encircle the periphery of an optical semiconductor element for wavelengths of 350-410 nm mounted on the metal lead frame, the material forming the reflector is a heat-curable resin composition for an optical semiconductor device and containing a heat-curable resin (A) and a white pigment (B) consisting of zirconium oxide. As a result, the formed reflector exerts high optical reflectance at the specific wavelength region of 350-410nm, and the heat-curable resin composition can be easily formed in a variety of shapes.
Inventors:
FUKAMICHI YUICHI (JP)
FUKE KAZUHIRO (JP)
BABA TOSHIKAZU (JP)
FUKE KAZUHIRO (JP)
BABA TOSHIKAZU (JP)
Application Number:
PCT/JP2014/081035
Publication Date:
June 11, 2015
Filing Date:
November 25, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L33/60; C08K3/22; C08L101/00; H01L33/62
Domestic Patent References:
| WO2008059856A1 | 2008-05-22 |
Foreign References:
| JP2013032442A | 2013-02-14 | |||
| JP2007234637A | 2007-09-13 |
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
Masahiko Nishifuji (JP)
Masahiko Nishifuji (JP)
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