Title:
HEAT-CURABLE RESIN COMPOSITION, AND PREPREG AND METAL FOIL-STACKED PLATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/015577
Kind Code:
A1
Abstract:
The present invention relates to a heat-curable resin composition, which is used in a printed circuit board for a semiconductor package, and a prepreg and a metal foil-stacked plate using same, and more specifically, provides the heat-curable resin and the prepreg and metal foil-stacked plate using same for a two-sided or a multilayer printed circuit board, which can provide the printed circuit board having a uniform insulation layer by using a novolac resin of a specific content as a hardening agent in a mixture of BT or cyanate resin and an epoxy resin, thereby suppressing separation of resins and inorganic fillers in a process of stacking the prepreg on the metal foil.
Inventors:
SHIM HEE-YONG (KR)
SHIM JUNG-JIN (KR)
KANG JEONG-AN (KR)
MIN HYUN-SUNG (KR)
SHIM JUNG-JIN (KR)
KANG JEONG-AN (KR)
MIN HYUN-SUNG (KR)
Application Number:
PCT/KR2012/005826
Publication Date:
January 31, 2013
Filing Date:
July 20, 2012
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
SHIM HEE-YONG (KR)
SHIM JUNG-JIN (KR)
KANG JEONG-AN (KR)
MIN HYUN-SUNG (KR)
SHIM HEE-YONG (KR)
SHIM JUNG-JIN (KR)
KANG JEONG-AN (KR)
MIN HYUN-SUNG (KR)
International Classes:
C08L63/00; B32B15/08; C08G59/18; C08J5/24; C08L79/00
Foreign References:
| JP2009242657A | 2009-10-22 | |||
| KR20070110455A | 2007-11-16 | |||
| JP2011074397A | 2011-04-14 | |||
| KR20070056111A | 2007-05-31 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (649-10 Yoksam-dong Kangnam-ku, Seoul 135-080, KR)
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Claims: