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Title:
HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/167579
Kind Code:
A1
Abstract:
A heat-curable resin composition which contains at least [A] an epoxy resin having at least two glycidyl groups, [B] a cyanate ester resin having at least two cyanate groups and [C] an amine compound and meets the requirements (1) and (2) mentioned below; and a prepreg and a fiber-reinforced composite material, each of which is produced using the heat-curable resin composition. (1) 0.25 ≤ (number of moles of glycidyl groups in the heat-curable resin composition)/(number of moles of cyanate groups in the heat-curable resin composition) ≤ 1.5 (2) 0.05 ≤ (number of moles of active hydrogen contained in an amino group in the heat-curable resin composition)/(number of moles of cyanate groups in the heat-curable resin composition) ≤ 0.5 Provided are: a heat-curable resin composition which can exhibit excellent mechanical properties and heat resistance under high-humidity environments after the absorption of moisture and has such excellent reactivity that the heat-curable resin composition can be cured within a short period; a prepreg which is produced by impregnating reinforcing fibers with a heat-curable resin composition and has excellent handling properties (tack properties) at room temperature; and a fiber-reinforced composite material comprising a heat-curable resin composition and reinforcing fibers.

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Inventors:
MISUMI JUN (JP)
MACHIDA GINPEI (JP)
SAKATA HIROAKI (JP)
Application Number:
PCT/JP2019/004260
Publication Date:
September 06, 2019
Filing Date:
February 06, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/56; C08J5/24; C08L63/00
Domestic Patent References:
WO2017038603A12017-03-09
Foreign References:
JP2017504499A2017-02-09
JPH10178040A1998-06-30
JPH06260536A1994-09-16
JP2012509961A2012-04-26
JP2011162710A2011-08-25
JPS62184015A1987-08-12
JPS62185720A1987-08-14
JP2005506394W
JP2017132896A2017-08-03
JP2009221460A2009-10-01
Other References:
JIS K 7236, 2009
JIS K 7237, 1995
JIS K 7171, 1994
See also references of EP 3760661A4
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