Title:
HEAT-CURABLE RESIN FILM AND SHEET FOR FORMING FIRST PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2017/061364
Kind Code:
A1
Abstract:
This sheet for forming a first protective film comprises a first substrate sheet and a heat-curable resin film disposed on one surface thereof, the heat-curable resin film being for forming a first protective film on a surface of a semiconductor wafer which has bumps, by applying the heat-curable resin film to the surface and thermally curing the film. The heat-curable resin film comprises a polymer component (A) and a heat-curable component (B0), the heat-curable component (B0) having a weight-average molecular weight of 450 or higher and a dispersity ratio of 10 or less.
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Inventors:
FUSE KEISHI (JP)
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
YAMAGISHI MASANORI (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/079255
Publication Date:
April 13, 2017
Filing Date:
October 03, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08L63/00; C08G59/18; C08L101/00; H01L21/304; H01L21/60; H01L23/29; H01L23/31
Foreign References:
| JP2015164197A | 2015-09-10 | |||
| JP2014070191A | 2014-04-21 | |||
| JP2002371262A | 2002-12-26 | |||
| JP2013075989A | 2013-04-25 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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