Title:
HEAT-CURED CONDUCTIVE PASTE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/083332
Kind Code:
A1
Abstract:
Provided is a heat-cured conductive paste composition having superior storage stability by preventing a decrease in conductivity or an increase in viscosity due to storage, even if copper, a copper alloy, a silver-coated copper that is copper coated by silver, or a coated copper alloy that is a copper alloy coated by silver is used as a conductive powder. The heat-cured conductive paste composition contains (A) a conductive powder, (B) a heat-cured resin, (C) a curing agent, and (D) an inorganic ion exchange body, wherein at least one selected from the group consisting of copper, a copper alloy, a silver-coated copper, or a silver-coated copper alloy is used as (A) the conductive powder, and a blocked polyisocyanate compound or a blocked polyisocyanate compound and an epoxy resin are contained as (B) the heat-cured resin.
Inventors:
MATSUBARA TOYOHARU
TOMEKAWA SATORU
ARAI TAKAMITSU
MOTOHISA YUTA
TOMEKAWA SATORU
ARAI TAKAMITSU
MOTOHISA YUTA
Application Number:
PCT/JP2014/005777
Publication Date:
June 11, 2015
Filing Date:
November 18, 2014
Export Citation:
Assignee:
KYOTO ELEX CO LTD (JP)
International Classes:
H01B1/22; C09D7/61; C09D163/00; C09D175/04; H01B1/00
Domestic Patent References:
| WO2014112433A1 | 2014-07-24 |
Foreign References:
| JP2011028985A | 2011-02-10 | |||
| JPS6345702A | 1988-02-26 | |||
| JPH10330611A | 1998-12-15 | |||
| JP2002161123A | 2002-06-04 | |||
| KR20140079268A | 2014-06-26 |
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
Patent business corporation Owner old patent firm (JP)
Patent business corporation Owner old patent firm (JP)
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