Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT DISSIPATING DEVICE FOR POWER CONVERTING MODULE, AND POWER CONVERTING MODULE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2018/174470
Kind Code:
A1
Abstract:
A heat dissipating device for a power converting module, according to an embodiment, comprises: a housing; a substrate disposed in the housing; a heating element which is disposed in the housing and is connected to the substrate; a first heat dissipating plate which is disposed in the housing and is coupled to the heating element; and a second heat dissipating plate disposed below the first heat dissipating plate, wherein the heating element is coupled to the side surface of the first heat dissipating plate, and the first heat dissipating plate is disposed between the substrate and the second heat dissipating plate.

More Like This:
Inventors:
SONG YOUNG KIL (KR)
Application Number:
PCT/KR2018/003069
Publication Date:
September 27, 2018
Filing Date:
March 16, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K7/20; H01L23/367; H01L23/40; H02M7/00
Foreign References:
KR100742802B12007-07-25
JP2000269671A2000-09-29
KR20160036397A2016-04-04
US20060126309A12006-06-15
JP2009164156A2009-07-23
Other References:
See also references of EP 3606305A4
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
Download PDF: