Title:
HEAT-DISSIPATING RUBBER COMPOSITION, THERMALLY CONDUCTIVE RUBBER COMPOSITION, HEAT-DISSIPATING MATERIAL, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/188952
Kind Code:
A1
Abstract:
The present invention provides: a thermally conductive rubber composition that makes it possible to obtain a cured product that has a low coefficient of thermal expansion, excellent heat resistance, and favorable tackiness; a heat-dissipating rubber composition that is used in the thermally conductive rubber composition; and a heat-dissipating material and a cured product that use the thermally conductive rubber composition. The heat-dissipating rubber composition includes a fluorine rubber and a cyclic phosphazene compound, there being 1–20 parts by mass of the cyclic phosphazene compound per 100 parts by mass of the fluorine rubber, and the cyclic phosphazene compound including a fluorocarbon-modified cyclic phosphazene compound. The thermally conductive rubber composition includes the heat-dissipating rubber composition and a thermally conductive filler.
Inventors:
YOSHIMOTO MITSUHIKO (JP)
SHIMOYAMA TAKAHIRO (JP)
IIZUKA MAMI (JP)
KUMAKI KENSUKE (JP)
HASHIMOTO HAYATO (JP)
SHIMOYAMA TAKAHIRO (JP)
IIZUKA MAMI (JP)
KUMAKI KENSUKE (JP)
HASHIMOTO HAYATO (JP)
Application Number:
PCT/JP2023/005494
Publication Date:
October 05, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
NISSHINBO HOLDINGS INC (JP)
International Classes:
C08L27/18; C08K5/5399; C08L63/00
Domestic Patent References:
| WO2001021630A1 | 2001-03-29 | |||
| WO2021085356A1 | 2021-05-06 |
Foreign References:
| JP2019085559A | 2019-06-06 | |||
| JP2019157065A | 2019-09-19 | |||
| JP2010232535A | 2010-10-14 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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