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Patent Searching and Data


Title:
HEAT DISSIPATING SHEET, HEAT DISSIPATING MEMBER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/189746
Kind Code:
A1
Abstract:
The present invention provides a heat dissipating sheet and a heat dissipating member which have high heat conductivity and insulation property. A heat dissipating sheet 10 comprises cohesive inorganic fillers 1 having a breaking strength of 20 MPa or less and an elastic modulus of 48 MPa or more, and a matrix resin 2, wherein equal to or more than half of the cohesive inorganic fillers 1 in the heat dissipating sheet 10 satisfy the following conditions A, B, and the cohesive inorganic fillers satisfying the following conditions A, B satisfy the following condition C or D. Condition A: The cohesive inorganic fillers are in surface contact with each other. Condition B: The aspect ratio is more than 1 and equal to or less than 2. Condition C: Among triangles formed with a straight line formed by a contact interface between the cohesive inorganic fillers as one side, and the centers of virtual circles of the cohesive organic fillers as apexes, a sum total St of the areas of triangles having an angle θ1 of 30 degrees or more, which is formed by connecting both ends of the straight line and each of the apexes, is 20% or more with respect to a sum total Sh of the cross-sectional areas of the cohesive inorganic fillers. Condition D: the sum total Sh is 90% or less with respect to a sum total Sv of the areas of the virtual circles of the cohesive inorganic fillers.

Inventors:
SAWAMURA Toshiyuki (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
TANAKA Toshiyuki (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
WATANABE Akira (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
HIDAKA Katsuhiko (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
Application Number:
JP2019/013966
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
MITSUBISHI CHEMICAL CORPORATION (1-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 51, 〒1008251, JP)
International Classes:
H01L23/373; C08K3/013; C08L101/00; H05K7/20
Domestic Patent References:
WO2012070289A12012-05-31
Foreign References:
JP2015189609A2015-11-02
JP2017059704A2017-03-23
Attorney, Agent or Firm:
TAZAKI Akira et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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