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Title:
HEAT DISSIPATING STRUCTURE OF ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/148662
Kind Code:
A1
Abstract:
Disclosed is a heat dissipating structure of an electronic apparatus, wherein an IC chip to be a heat generating body is placed on a substrate, and heat is dissipated by having a heat dissipating sheet between the IC chip and a cover member. In the structure, even if variation in the gap between the IC chip and the cover member is generated, heat is sufficiently dissipated and reliability of the electronic apparatus is improved by having, with suitable pressure, the IC chip and the heat dissipating sheet in contact with each other, and the heat dissipating sheet and the cover member in contact with each other. The heat dissipating sheet (1) has a double structure wherein a first heat dissipating sheet (11) and a second heat dissipating sheet (12) are laminated in the thickness direction. The rubber hardness of the first heat dissipating sheet and that of the second heat dissipating sheet are set different from each other, and the softer heat dissipating sheet and the harder heat dissipating sheet are laminated in the direction of the gap between the IC chip (3) and the cover member (4).

Inventors:
KURODA TATSURO
Application Number:
PCT/JP2011/051202
Publication Date:
December 01, 2011
Filing Date:
January 24, 2011
Export Citation:
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Assignee:
SHARP KK (JP)
KURODA TATSURO
International Classes:
H01L23/36; H05K7/20
Foreign References:
JPH10308484A1998-11-17
JPH11307697A1999-11-05
JPH02196453A1990-08-03
JP2009259944A2009-11-05
JP2007067201A2007-03-15
JP2009076813A2009-04-09
JP2009212390A2009-09-17
JP2007180281A2007-07-12
Attorney, Agent or Firm:
SANO SHIZUO (JP)
Shizuo Sano (JP)
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Claims:



 
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