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Title:
HEAT DISSIPATING STRUCTURE FOR ELECTRONIC UNITS AND DISPLAY DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/203150
Kind Code:
A1
Abstract:
Provided are a heat dissipating structure with which stress on an electronic unit that generates heat can be reduced, and a display device comprising the same. The heat dissipating structure comprises: at least two electronic units, e.g. electronic units 43, 44, 45, that are provided on a circuit board 4, differ from one another in height from the circuit board 4, and generate heat; a dissipating member 8 for dissipating heat generated from the electronic units 43, 44, 45; and heat conducting members 6 that are sandwiched between the electronic units 43, 44, 45 and the heat dissipating member 8 so as to conduct heat, wherein the heat conducting members 6 provided between the electronic units 43, 44, 45 and the heat dissipating member 8 have the same thickness.

Inventors:
IKENO Mitsuru
Application Number:
JP2019/015956
Publication Date:
October 24, 2019
Filing Date:
April 12, 2019
Export Citation:
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Assignee:
NIPPON SEIKI CO.,LTD. (2-34, Higashi-zaoh 2-chomeNagaoka-sh, Niigata 80, 〒9408580, JP)
International Classes:
H01L23/36; B60K35/00; B60R16/02
Foreign References:
JPH06224334A1994-08-12
JP2000311971A2000-11-07
JP2012199332A2012-10-18
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