Title:
HEAT DISSIPATING STRUCTURE FOR ELECTRONIC UNITS AND DISPLAY DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/203150
Kind Code:
A1
Abstract:
Provided are a heat dissipating structure with which stress on an electronic unit that generates heat can be reduced, and a display device comprising the same. The heat dissipating structure comprises: at least two electronic units, e.g. electronic units 43, 44, 45, that are provided on a circuit board 4, differ from one another in height from the circuit board 4, and generate heat; a dissipating member 8 for dissipating heat generated from the electronic units 43, 44, 45; and heat conducting members 6 that are sandwiched between the electronic units 43, 44, 45 and the heat dissipating member 8 so as to conduct heat, wherein the heat conducting members 6 provided between the electronic units 43, 44, 45 and the heat dissipating member 8 have the same thickness.
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Inventors:
IKENO MITSURU
Application Number:
PCT/JP2019/015956
Publication Date:
October 24, 2019
Filing Date:
April 12, 2019
Export Citation:
Assignee:
NIPPON SEIKI CO LTD (JP)
International Classes:
B60K35/00; H01L23/36; B60R16/02
Foreign References:
| JPH06224334A | 1994-08-12 | |||
| JP2000311971A | 2000-11-07 | |||
| JP2012199332A | 2012-10-18 |
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