Title:
HEAT-DISSIPATING STRUCTURE FOR AN LED LAMP
Document Type and Number:
WIPO Patent Application WO/2011/149312
Kind Code:
A1
Abstract:
The present invention relates to a heat-dissipating structure for an LED lamp, which is lightweight and has a maximized heat-dissipating area. The heat-dissipating structure for an LED lamp comprises a frame and a heat-dissipating member. The frame includes: an upper disk having an upper surface on which a power supply unit is arranged; a lower disk having a lower surface on which an LED substrate equipped with a plurality of high-luminance LEDs are arranged; and a rod-shaped connection member, both ends of which are fixed at the center of a lower surface of the upper disk and at the center of an upper surface of the lower disk, respectively, so as to integrally connect the upper disk and the lower disk, and the interior of which is hollow and in which a power cable is installed. The heat-dissipating member is fixed between the upper disk and the lower disk of the frame, and is formed into layers of disks, wherein each disk is made of two or more members which are in contact with each other so as to form an annular plane. The disks are continuously overlapped with each other to form a plurality of stacked layers. The diameter of the disk in each layer gradually increases from top to bottom.
Inventors:
LIM, Yeong Soo (419 Samrak-dong Sasang-gu, Busan-si 740-200, 740-200, KR)
Application Number:
KR2011/003923
Publication Date:
December 01, 2011
Filing Date:
May 27, 2011
Export Citation:
Assignee:
LIM, Yeong Soo (419 Samrak-dong Sasang-gu, Busan-si 740-200, 740-200, KR)
International Classes:
F21V29/00
Attorney, Agent or Firm:
CHOI, Young-Min (Vniel B/D 2F, 1362-9 Seocho-dongSeocho-gu, Seoul 137-070, 137-070, KR)
Claims: