Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT-DISSIPATING STRUCTURE AND ONBOARD POWER SUPPLY DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/079141
Kind Code:
A1
Abstract:
A heat-dissipating structure has a first housing, a second housing, a first heat-dissipating fin and/or a second heat-dissipating fin, and a connecting part. The first housing contains a first heat-generating component, and the second housing contains a second heat-generating component. The first heat-dissipating fin is provided on an outer surface of the first housing, and the second heat-dissipating fin is provided on an outer surface of the second housing. The connecting part thermally connects the first housing and the second housing via the first heat-dissipating fin and/or the second heat-dissipating fin.

Inventors:
ICHINOSE ATSUSHI
Application Number:
PCT/JP2017/034039
Publication Date:
May 03, 2018
Filing Date:
September 21, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H02M7/48; H05K7/20
Domestic Patent References:
WO2017046180A12017-03-23
Foreign References:
JPH0767213A1995-03-10
JPH11266508A1999-09-28
JPH0715975A1995-01-17
JP2015231267A2015-12-21
JP2003244958A2003-08-29
JPH10502217A1998-02-24
JP2003037981A2003-02-07
JP2011192953A2011-09-29
JPS52124120U1977-09-21
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RICE COOKER

Next Patent: MULTILAYER SUBSTRATE WITH BUILT-IN COIL AND POWER SUPPLY MODULE