Title:
HEAT DISSIPATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/016144
Kind Code:
A1
Abstract:
Provided is a heat dissipating structure whereby heat dissipation efficiency of an electronic component can be sufficiently improved.
An electronic apparatus (1) has a heat dissipating structure for dissipating heat of a first electronic component (10A) mounted on one surface of an electronic substrate (30). The electronic apparatus (1) is provided with a heat sink (40A) and a heat dissipating grease (50A). The heat sink (40A) is provided on the side of the other surface of the electronic substrate (30) by being separated from the electronic substrate (30). The heat dissipating grease (50A) is provided between terminals (12) of the first electronic component (10A) and the heat dissipating grease (50A).
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Inventors:
TOMITA HARUKI (JP)
EGUCHI YUU (JP)
EGUCHI YUU (JP)
Application Number:
PCT/JP2017/015568
Publication Date:
January 25, 2018
Filing Date:
April 18, 2017
Export Citation:
Assignee:
KYB CORP (JP)
International Classes:
H05K7/20; H01L23/36; H01L23/40; H05K1/18
Domestic Patent References:
| WO2015076050A1 | 2015-05-28 |
Foreign References:
| JP2001068607A | 2001-03-16 | |||
| US7176707B1 | 2007-02-13 | |||
| JP2008205356A | 2008-09-04 | |||
| JPH03128965U | 1991-12-25 |
Attorney, Agent or Firm:
KATO Seiji (JP)
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