Title:
HEAT DISSIPATING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/029909
Kind Code:
A1
Abstract:
Provided is a heat dissipating structure enabling to sufficiently improve dissipation efficiency of heat generated in an electronic component.
An electronic apparatus (1) has a heat dissipating structure for dissipating heat generated in an electronic component (10) that is mounted on one surface of an electronic substrate (20). The electronic apparatus (1) is provided with a heat sink (30), a heat dissipating grease (50), and an external force applying unit (70). The heat sink (30) is provided on the one surface side of the electronic substrate (20) by having a gap between the electronic component (10) and the heat sink. The heat dissipating grease (50) is provided between the electronic component (10) and the heat sink (30). The external force applying unit (70) applies, to the electronic substrate (20) and/or the heat sink (30), an external force in the direction in which the gap between the electronic substrate (20) and the heat sink (30) is reduced.
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| JPH08162785 | EXTENSION CARD |
Inventors:
TOMITA HARUKI (JP)
EGUCHI YUU (JP)
EGUCHI YUU (JP)
Application Number:
PCT/JP2017/015569
Publication Date:
February 15, 2018
Filing Date:
April 18, 2017
Export Citation:
Assignee:
KYB CORP (JP)
International Classes:
H05K7/20; H01L23/36; H01L23/40
Domestic Patent References:
| WO2014115456A1 | 2014-07-31 | |||
| WO2008065718A1 | 2008-06-05 |
Foreign References:
| JP2016036013A | 2016-03-17 | |||
| JP2000196269A | 2000-07-14 | |||
| US6386890B1 | 2002-05-14 | |||
| JP2011258831A | 2011-12-22 | |||
| US6743026B1 | 2004-06-01 |
Attorney, Agent or Firm:
KATO Seiji (JP)
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