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Title:
HEAT DISSIPATION APPARATUS AND COMPUTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/186147
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a heat dissipation apparatus and a computing device. The heat dissipation apparatus comprises a shell and at least one heat dissipation fan mounted in the shell; the shell comprises a first panel and side walls arranged in the circumferential direction of the first panel; the at least one heat dissipation fan is arranged on the first panel; the first panel is provided with a first hollow structure corresponding to the at least one heat dissipation fan; the side, away from the first panel, of the at least one heat dissipation fan is configured to face a component to be cooled. According to the technical solution in the present disclosure, the shell can protect the heat dissipation fan, so that external dust entering the heat dissipation fan can be reduced, external dust entering the computing device along with the airflow can be reduced, the cleanliness of devices in the computing device is guaranteed, and the computing efficiency of the computing device can be improved.

Inventors:
ZHANG SHAOHUA (CN)
ZHANG NANGENG (CN)
Application Number:
PCT/CN2023/085698
Publication Date:
October 05, 2023
Filing Date:
March 31, 2023
Export Citation:
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Assignee:
CANAAN CREATIVE CO LTD (CN)
International Classes:
G06F1/20
Foreign References:
CN217426061U2022-09-13
CN112306168A2021-02-02
CN108646890A2018-10-12
CN112394780A2021-02-23
CN112394781A2021-02-23
CN205680045U2016-11-09
CN212906116U2021-04-06
CN213276517U2021-05-25
CN112506303A2021-03-16
CN209962183U2020-01-17
CN213780844U2021-07-23
CN214586772U2021-11-02
US20100053884A12010-03-04
US20150245536A12015-08-27
Attorney, Agent or Firm:
CHANG TSI & PARTNERS (CN)
Download PDF:
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