Title:
HEAT DISSIPATION ARCHITECTURE OF PHOTOELECTRIC MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/046439
Kind Code:
A1
Abstract:
The present application relates to the technical field of photoelectric modules. Disclosed are a heat dissipation architecture of a photoelectric module and an electronic device. The heat dissipation architecture comprises: an electrical chip; a plurality of light engines distributed along the periphery of the electrical chip; and a cold plate. The cold plate comprises: a primary cold plate for dissipating heat of the electrical chip; a secondary cold plate for dissipating heat of at least one of the plurality of light engines; and a heat pipe assembly corresponding to the secondary cold plate. The heat pipe assembly comprises at least one heat pipe, and the at least one heat pipe has an evaporation end connected to the secondary cold plate and a condensation end connected to the primary cold plate. The primary cold plate is provided with a flow channel for dissipating heat of the heat pipe assembly, and the secondary cold plate has a maintenance station; when the secondary cold plate is located at the maintenance station, an operation space for maintaining a corresponding light engine is formed between the secondary cold plate and the corresponding light engine.
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Inventors:
LV XIAOLONG (CN)
LIU WEI (CN)
LAI GUOHONG (CN)
LIU WEI (CN)
LAI GUOHONG (CN)
Application Number:
PCT/CN2023/116294
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
RUIJIE NETWORKS CO LTD (CN)
International Classes:
G02B6/42; H05K7/20
Foreign References:
| CN206657307U | 2017-11-21 | |||
| CN101420838A | 2009-04-29 | |||
| CN107920458A | 2018-04-17 | |||
| CN114615866A | 2022-06-10 | |||
| CN202306432U | 2012-07-04 | |||
| US20070091570A1 | 2007-04-26 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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