Title:
HEAT DISSIPATION ASSEMBLY AND FABRICATION METHOD THEREFOR, MIDDLE FRAME ASSEMBLY, HOUSING ASSEMBLY, AND TERMINAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/245376
Kind Code:
A1
Abstract:
The present disclosure relates to a heat dissipation assembly and a fabrication method therefor, a middle frame assembly, a housing assembly, and a terminal device. The heat dissipation assembly comprises an evaporator, a condenser, and a first pipe. The evaporator is provided with an output end, the condenser is provided with an inlet end, and the first pipe is communicated with the output end of the evaporator and the inlet end of the condenser. At least a part of an inner wall of the first pipe is provided with a capillary structure. According to the described structure, at least a part of the inner wall of the first pipe is provided with a capillary structure, so that the flowing of steam in the first pipe is prevented from being affected by liquid droplets formed in the first pipe, thus improving the working stability of the heat dissipation assembly.
Inventors:
CHEN ANQI (CN)
HUANG DUZI (CN)
LIU MINGYAN (CN)
WANG HENGCHAO (CN)
ZHAO RAN (CN)
HUANG DUZI (CN)
LIU MINGYAN (CN)
WANG HENGCHAO (CN)
ZHAO RAN (CN)
Application Number:
PCT/CN2022/099941
Publication Date:
December 28, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
BEIJING XIAOMI MOBILE SOFTWARE CO LTD (CN)
International Classes:
F28D15/04
Foreign References:
| CN113983843A | 2022-01-28 | |||
| CN111163621A | 2020-05-15 | |||
| CN101655328A | 2010-02-24 | |||
| CN205580271U | 2016-09-14 | |||
| CN110715570A | 2020-01-21 | |||
| TWI679393B | 2019-12-11 |
Attorney, Agent or Firm:
BEIJING BESTIPR INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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