Title:
HEAT DISSIPATION ASSEMBLY AND MOTION CAMERA
Document Type and Number:
WIPO Patent Application WO/2020/220166
Kind Code:
A1
Abstract:
Disclosed is a heat dissipation assembly (13), used for a motion camera (1), and comprising a heat pipe (131) and a first heat dissipation plate (132). Both an evaporation end (1311) and a condensation end (1312) of the heat pipe (131) make heat transfer contact with the first heat dissipation plate (132); and the first heat dissipation plate (132) is used for making heat transfer contact with a master chip (11) and is used for making heat transfer contact with a housing (19) of the motion camera (1), so as to enable the heat of the master chip (11) to be conducted via the housing (19). Therefore, the heat of the master chip (11) can be transferred to the heat pipe (131) and the first heat dissipation plate (132) and conducted via the housing (19), creating heat transfer contact with the first heat dissipation plate (132), such that a good heat dissipation effect on the master chip (11) is achieved, the heat dissipation assembly (13) is compact in structure, small in the space occupied and small in influence on the size of the motion camera (1), and the portability of the motion camera (1) is thus facilitated.
Inventors:
GUO SHENGJIA (CN)
NONG GUISHENG (CN)
JING KUNPENG (CN)
NONG GUISHENG (CN)
JING KUNPENG (CN)
Application Number:
PCT/CN2019/084839
Publication Date:
November 05, 2020
Filing Date:
April 28, 2019
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H05K7/20; G03B17/55; G06F1/20
Foreign References:
| CN207369504U | 2018-05-15 | |||
| CN101539711A | 2009-09-23 | |||
| CN107153317A | 2017-09-12 |
Other References:
See also references of EP 3751973A4
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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