HEAT DISSIPATION ASSEMBLY AND REFRIGERATION DEVICE

Title:

HEAT DISSIPATION ASSEMBLY AND REFRIGERATION DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/149032

Kind Code:

A1

Abstract:

A heat dissipation assembly (1) and a refrigeration device. The heat dissipation assembly (1) comprises: a base plate (102), a fan (204) being provided on one side of the base plate (102), and a condenser (202) being provided on the base plate (102); fasteners (104) provided on the upper surface of the base plate (102) and facing the condenser (202); and first wind shields (106) provided on the lower surface of the base plate (102). The heat dissipation assembly (1) enable most of air in an airflow formed by the fan to flow through the condenser (202) on the base plate (102) and take away heat, and air flowing through the lower portion of the base plate (102) can be reduced by providing the first wind shields (106) on the lower surface of the base plate (102), so that the air flow and flow velocity loss as well as resistance and noise of the airflow in the flow process are reduced, the utilization efficiency of the fan air volume is improved, the heat dissipation area of the condenser is increased, the heat dissipation and heat exchange capacities of the condenser are improved, the supercooling degree of a refrigerant at an outlet of the condenser is increased, and the refrigeration effect is improved.

Inventors:

WANG YAODONG (CN)
XIE LIANGZHU (CN)
ZHANG HAIBIN (CN)
YAO NANFEI (CN)
ZHANG HUI (CN)
ZHANG JIZHE (CN)
MING LELE (CN)
PENG XIAOKANG (CN)
LAN YUAN (CN)
OU CHUBIN (CN)

Application Number:

PCT/CN2017/082520

Publication Date:

August 23, 2018

Filing Date:

April 28, 2017

Export Citation:

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Assignee:

MIDEA GROUP CO LTD (CN)

International Classes:

F25D19/00

Foreign References:

CN102401526A	2012-04-04
KR20030056416A	2003-07-04
JPH0526562A	1993-02-02
CN2639814Y	2004-09-08
CN105571236A	2016-05-11

Other References: