Title:
HEAT DISSIPATION ASSEMBLY, VEHICLE MODULE, AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2023/071705
Kind Code:
A1
Abstract:
The present application provides a heat dissipation assembly, a vehicle module, and a vehicle. The heat dissipation assembly comprises a circuit board, one or more chips, a heat dissipation device, and a first cooling working medium, and the one or more chips are provided on the circuit board; the heat dissipation device and the circuit board jointly define a closed space, and the one or more chips are located in the closed space; the first cooling working medium is provided in the closed space and immerses the one or more chips, the first cooling working medium is configured to transfer heat of the one or more chips to the heat dissipation device by means of gas-liquid conversion, and the first cooling working medium is a non-conductive liquid. The technical solution of the present application can achieve good heat dissipation for the chip while ensuring that the chip has good working reliability, so that the vehicle applying the chip has good heat dissipation benefits.
Inventors:
PENG YAOFENG (CN)
LI QUANMING (CN)
SHI JIAN (CN)
LI QUANMING (CN)
SHI JIAN (CN)
Application Number:
PCT/CN2022/123034
Publication Date:
May 04, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN114449795A | 2022-05-06 | |||
| US20150109735A1 | 2015-04-23 | |||
| CN107203253A | 2017-09-26 | |||
| CN213207571U | 2021-05-14 | |||
| CN109637987A | 2019-04-16 | |||
| CN208547905U | 2019-02-26 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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