Title:
HEAT DISSIPATION CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/173668
Kind Code:
A1
Abstract:
This heat dissipation circuit board (10) is provided with: a metal substrate (11); an insulating layer (12) which is arranged on at least one surface of the metal substrate (11); and a circuit layer (13) which is arranged on a surface of the insulating layer (12), said surface being on the reverse side of the metal substrate (11)-side surface. The insulating layer (12) contains a resin, which is composed of a polyimide, a polyamideimide or a mixture of a polyimide and a polyamideimide, and ceramic particles which have a specific surface area of 10 m2/g or more. The ceramic particles form aggregated particles; and the content of the ceramic particles is within the range of from 5% by volume to 60% by volume (inclusive).
Inventors:
ISHIKAWA FUMIAKI (JP)
YAMASAKI KAZUHIKO (JP)
YAMASAKI KAZUHIKO (JP)
Application Number:
PCT/JP2018/007507
Publication Date:
September 27, 2018
Filing Date:
February 28, 2018
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H05K1/05; C08L79/08; H01L23/12; H01L23/14; H01L23/36; H05K1/03
Domestic Patent References:
| WO2018025538A1 | 2018-02-08 |
Foreign References:
| JP2014156545A | 2014-08-28 | |||
| JP2014031484A | 2014-02-20 | |||
| JP2003318500A | 2003-11-07 | |||
| JPH1087990A | 1998-04-07 | |||
| JPH06216484A | 1994-08-05 | |||
| JP2017057098A | 2017-03-23 | |||
| JP2017057460A | 2017-03-23 | |||
| JPS5650084B2 | 1981-11-26 | |||
| JP5665846B2 | 2015-02-04 |
Other References:
JOURNAL OF INTERNATIONAL COUNCIL ON ELECTRICAL ENGINEERING, vol. 2, no. 1, 2012, pages 90 - 98
See also references of EP 3606298A4
See also references of EP 3606298A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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